Transcription
Dell EMC PowerEdge MX750cTechnical GuideRegulatory Model: E04BRegulatory Type: E04B003December 2021Rev. A04
Notes, cautions, and warningsNOTE: A NOTE indicates important information that helps you make better use of your product.CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoidthe problem.WARNING: A WARNING indicates a potential for property damage, personal injury, or death. 2021 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries. Othertrademarks may be trademarks of their respective owners.
ContentsChapter 1: System overview. 5Key workloads. 5New technologies. 5Chapter 2: System features and generational comparison. 6Chapter 3: Chassis views and features. 8Chassis views.8Front view of the system.8Inside the system. 9Quick Resource Locator.9Chapter 4: Processor.11Processor features . 11Supported processors.11Chipset.12Chapter 5: Memory subsystem.13DIMM types. 13DIMM speed and frequency. 13Memory RAS features.14Chapter 6: Storage. 16Storage controllers. 16Supported HDDs and SSDs. 16External Storage.19Chapter 7: Networking. 20Mezzanine Card Slot Priority Matrix. 20Chapter 8: PCIe. 21PCIe subsytem. 21Chapter 9: Power, thermal, and acoustics. 23Power. 23Thermal. 24Thermal design. 24Acoustics. 25Acoustical performance. 26Chapter 10: Supported Operating Systems. 28Chapter 11: Dell EMC OpenManage systems management.29Contents3
Server and Chassis Managers.30Dell EMC consoles. 30Automation Enablers. 30Integration with third-party consoles.30Connections for third-party consoles. 30Dell EMC Update Utilities. 30Dell resources.30Chapter 12: Dell Technologies Services .32Dell EMC ProDeploy Enterprise Suite . 32Dell EMC ProDeploy Plus.33Dell EMC ProDeploy.33Basic Deployment. 33Dell EMC ProDeploy for HPC. 33Dell EMC Server Configuration Services. 34Dell EMC Residency Services.34Dell EMC Data Migration Service. 34Dell EMC ProSupport Enterprise Suite. 34Dell EMC ProSupport Plus for Enterprise. 35Dell EMC ProSupport for Enterprise. 35Dell EMC ProSupport One for Data Center.36ProSupport for HPC. 36Support Technologies. 36Services for Data Security. 37Dell Technologies Education Services.38Dell Technologies Consulting Services.38Dell EMC Remote Consulting Services. 38Dell EMC Managed Services. 38Chapter 13: Appendix A. Additional specifications. 39Chassis dimension. 39Chassis weight. 39Video specifications for iDRAC. 39USB Ports. 40Environmental Specifications. 40Thermal restrictions.41Chapter 14: Appendix B. Standards compliance. 44Chapter 15: Appendix C Additional resources.454Contents
1System overviewDesigned to run a variety of high-performance workloads, PowerEdge MX750c is the 2-socket modular server for the Dell EMCPowerEdge MX infrastructure. This server features the Intel Xeon Scalable processor family, with up to 32 DIMMs, PCIExpress (PCIe) 4.0 enabled I/O slots, and a choice of high bandwidth Ethernet and Fiber Channel mezzanine cards.Topics: Key workloadsNew technologiesKey workloadsDesigned for Dell EMC's PowerEdge MX infrastructure ecosystem, the PowerEdge MX750c server, with dense compute,large memory capacity and rich set of storage subsystem options, delivers the flexibility and agility needed in today's softwaredefined data centers. This full-featured, storage-rich, flexible 2-socket compute sled is ideal for virtualization, containerization,collaborative, and software-defined workloads given the low-latency capabilities of the MX ecosystem networking portfolio.New technologiesTable 1. New Technologies featured on the MX750cTechnologyDetailed DescriptionIntel Xeon Scalable processorsWorkload-optimized processors to support hybrid cloudinfrastructures and the most high-demand applications.3rd Generation Intel Xeon Scalable processors Up to 40 cores per socket Up to 3.8 GHz Up to 270 W for TDP (Please refer to processor restriction– Thermal Restriction Matrix) Intel Ultra Path Interconnect (UPI) up to 11.2 GT/s withup to three links between sockets 10 nm process technologyConsult the processor section for specific SKUs offered.Intel C627A ChipsetIntel Platform Controller Hub (PCH) Optional Intel QuickAssist Technology (QAT)DDR4 ECC/Intel Intel Optane Persistent Memory 200 Seriesmemory up to 3200 MT/s8 DDR4 channels per socket, 2 DIMMs per channel (2DPC) Up to 3200 MT/s (depending on configuration) RDIMM, LRDIMM and Intel Intel Optane PersistentMemory 200 Series memory supportConsult the memory section for specific details.iDRAC9 with Lifecycle ControllerWorks in conjunction with OpenManage Enterprise - Modular,embedded systems management solution for Dell EMCservers' features hardware and firmware inventory andalerting, faster performance and many more features.System overview5
2System features and generationalcomparisonThe following table shows the comparison between the PowerEdge MX750c with the PowerEdge MX740c:Table 2. Features compared to previous versionFeaturePowerEdge MX750cPowerEdge MX740cProcessorUp to two 3rd Generation Intel Xeon Scalable ProcessorsUp to two Intel Xeon ScalableProcessorsDIMM Speed: Up to 3200 MT/sOne or two 2nd Generation Intel Xeon Scalable ProcessorsUp to 40 cores per socketMax TDP: 270 WUp to 28 cores per socketMax TDP: 205 WChipsetIntel C627AIntel C628Memory32 DDR4 DIMM slots24 DIMM slots32 slots for RDIMMs and LRDIMMs12 slots enabled for NVDIMM-NMaximum capacity (RDIMM): 2 TBMaximum capacity (RDIMM): 1.5 TBMaximum capacity (LRDIMM): 8 TBMaximum capacity (LRDIMM): 3 TBIntel Optane PMem 200 SeriesMaximum capacity (NVDIMM-N): 192GBIntel Optane PMem 100 SeriesStorage ControllersS150 Software RAIDS140 Software RAIDHBA350i MXHBA330 MXH745P MX Performance RAID via PERC10, internal and external drive connect,8GB NV cacheH730P MX Performance RAID, 2 GB NVcacheH755 Performance RAID, NVMe RAIDHBA330 MX mini-mezz, HBA, externaldrive connect, no cacheDrive SupportDrive Backplanes6H745P MX Performance RAID, internaland external drive connect, 8 GB NVcacheHBA330 MX mini-mezz, HBA, externaldrive connect, no cache2.5-inch 12 Gb SAS2.5-inch 12 Gb SAS2.5-inch 6 Gb SATA2.5-inch 6 Gb SATA2.5-inch NVMe2.5-inch NVMe6 x 2.5-inch SAS/SATA6 x 2.5-inch SAS/SATA6 x 2.5-inch SATA/NVMe (universal BP)6 x 2.5-inch SAS/SATA/NVMe4 x 2.5-inch SAS/SATA/NVMe(universal BP)4 x 2.5-inch SAS/SATA/NVMe forNVDIMM implementationsSystem features and generational comparison
Table 2. Features compared to previous version (continued)FeaturePowerEdge MX750cPowerEdge MX740cInternal BootChoice of BOSS (Boot OptimizedStorage Subsystem) or IDSDM (InternalDual SD Module)Choice of BOSS (Boot OptimizedStorage Subsystem) or IDSDM (InternalDual SD Module)I/O SlotsTwo PCIe 4.0 x16 Mezz slots (Fabric Aand B)Two PCIe 3.0 x16 Mezz slots (Fabric Aand B)One PCIe 4.0 x16 Mini-mezz slot (FabricC)One PCIe 3.0 x16 Mini-mezz slot (FabricC)One internal USB 3.0 portOne internal USB 3.0 portOne external USB 3.0 portOne external USB 3.0 portUSBOne USB 2.0 management port to iDRAC One USB 2.0 management port to iDRACOne USB 3.0 USB 2.0 port for IDSDMVideoOne USB 3.0 USB 2.0 port for IDSDMIntegrated VGA controller in iDRAC, VGA Integrated VGA controller in iDRAC, VGAover LANover LAN4 Gb DDR4 shared with iDRACapplication memory4 Gb DDR4 shared with iDRACapplication memoryManagementiDRAC9iDRAC9SecurityOptional TPM 1.2/2.0Optional TPM 1.2/2.0Cryptographically signed firmwareCryptographically signed firmwareSilicon Root of TrustSilicon Root of TrustSecure BootSecure BootSystem LockdownSystem LockdownSystem EraseSystem EraseFansIn chassisIn chassisPower SuppliesPower provided by chassisPower provided by chassisChassisMX7000MX7000System features and generational comparison7
3Chassis views and featuresTopics: Chassis viewsChassis viewsFront view of the systemFigure 1. Front view, up to 6 drive configuration8Chassis views and features
Inside the systemFigure 2. Internal viewQuick Resource LocatorThe QRL on the system information label is a generic QRL for the MX750c that leads to a product web page which containslinks to installation, setup, service, and instructional videos and documents specific to the MX750c.Figure 3. System information label (QRL for MX750c)Previously, the default EST label applied on the top of the server pullout luggage tab did not include a barcode for customersto capture the Service Tag #. As of March 2021, customers can now access, on all 14G and 15G servers (except OEM), thebarcoded Service Tag number directly from the pullout luggage tag making Service Tag capture for PowerEdge servers easy andconvenient.Chassis views and features9
Figure 4. Example of Express Service Tag (EST) label10Chassis views and features
4ProcessorTopics: Processor featuresSupported processorsChipsetProcessor featuresThe 3 rd Generation Xeon Scalable Processors stack is a next generation data center CPU offering with the latest features,increased performance, and incremental memory options. This latest generation Xeon Scalable processor will support usagesfrom entry designs based on Intel Xeon Silver processors to advanced capabilities offered in new Intel Xeon Platinum processorThe following lists the features and functions included in the upcoming 3 rd Generation Intel Xeon Scalable Processor offering: Faster UPI with 3 Intel Ultra Path Interconnect (Intel UPI) at 11.2 GT/s (supported in gold and platinum options)More, Faster I/O with PCI Express 4 and up to 64 lanes (per socket) at 16 GT/sEnhanced Memory Performance with support for up to 3200MT/s DIMMs (2 DPC)Increased Memory Capacity with up to 8 channels and up to 256GB DDR4 DIMM supportBreakthrough System Memory with Intel Optane persistent memory 200 series ( Intel Optane Persistent Memory 200 Series,up to 512GB modules (up to 6TB of total system memory/socket DDR PMM)Supported processorsTable 3. Supported processors for PowerEdge MX750cProcClockCacheSpeed(G 80Turbo32006 TBY270 W83622.84811.23264Turbo32006 TBY265 W8360Y2.45411.23672Turbo32006 TBY250 W83582.64811.23264Turbo32006 TBY250 W8352M2.34811.23264Turbo32006 TBY185 W8352Y2.24811.23264Turbo32006 TBY205 W8352V2.15411.23672Turbo29336 TBY195 W8352S2.24811.23264Turbo32006 TBY205 W63482.64211.22856Turbo32006 TBY235 W633823611.23264Turbo32006 TBY205 W633024211.22856Turbo29336 TBY205 W6314U2.34811.23264Turbo32006 TBY205 WProcessor11
Table 3. Supported processors for PowerEdge MX750c (continued)ProcClockCacheSpeed(G 48Turbo32006 TBY230 W6336Y2.43611.22448Turbo32006 TBY185 W63343.61811.2816Turbo32006 TBY165 W63262.92411.21632Turbo32006 TBY185 W6312U2.43611.22448Turbo32006 TBY185 W53202.23911.22652Turbo29336 TBY185 W5318Y2.13611.22448Turbo29336 TBY165 W531731811.21224Turbo29336 TBY150 W43162.33010.42040Turbo26666 TBN150 W43142.42410.41632Turbo26666 TBY135 WChipsetIntel C627A ( LBG-R B3 stepping) series Chipset FeaturesUSB ports - up to 10 superspeed (USB 3.0), 14 highspeed (USB 2.0)SATA ports - up to 14 SATA Gen3 6Gb/sTPM Support - TPM 2.0The MX750c uses the Intel C627A chipset with optional Intel QuickAssist technology (Intel QAT).12Processor
5Memory subsystemFor 15G 3rd generation Intel Xeon processor scalable family offers, the best approach to memory configuration is to remember,"Balanced, Balanced & Balanced." Customers should be purchasing balanced configurations to ensure that they can gain theperformance improvements that are being claimed for the platforms. Below is an overview of the DIMM characteristics includingIntel Optane Persistent Memory 200 Series:Topics: DIMM typesDIMM speed and frequencyMemory RAS featuresDIMM typesThe MX750c supports two different dual in-line memory module (DIMM) types that can meet customer needs depending onhow they prioritize R.A.S. (reliability, availability, and serviceability) and power consumption.Dell supports two DIMM types on the MX750c: RDIMM: Registered DIMM – Provides for higher capacity options and advanced RAS features. LRDIMM: Load Reduced DIMM – Provides maximum capacity but higher power consumption.RDIMM , or registered memory, is the most commonly used DIMM type, and offers the best mix of frequency, capacity, and rankstructure choices. It provides high signal integrity - performing parity checking to detect improper addresses or commands - andincreased performance for heavy workloads.RDIMMs (Single Rank and Dual Rank) MaximumMaximumMaximumMaximumfrequency of 3200 MT/s (Depending on processor)frequency using 2 DIMMs per channel of 3200 MT/scapacity of 64GB per DIMMsystem capacity of 2 TBLRDIMM, or load-reduced memory, uses a buffer to reduce memory loading to a single load on all DDR signals, allowing forgreater density.LRDIMMs MaximumMaximumMaximumMaximumfrequency of 3200 MT/sfrequency using 2 DIMMs per channel of 2666 MT/scapacity of 256GB per DIMMsystem capacity of 8 TBDIMM speed and frequencyThe memory offerings for the MX750c is based on double-data rate type 4 (DDR4) memory which operates at 1.2 volts.The processor SKU stack has memory speed support and limits by bin.Table 4. Processor memory speed support by CPUCPU Metal Tier3200 MT/s2933 dSupportedSupportedSupportedMemory subsystem13
Table 4. Processor memory speed support by CPU (continued)CPU Metal Tier3200 MT/s2933 MT/s2666MT/sSilverNot supportedNot supportedSupportedNOTE: *3rd Generation Intel Xeon Scalable ProcessorOnly 3200 MT/s, 2933 MT/s and 2666 MT/s DIMMs have been validated on the MX750c and will clock down based on CPU binsupport level.Memory RAS featuresReliability, Availability, and Serviceability (RAS) features help keep the system online and operational without significant impactto performance and can decrease data loss and crashing due to errors. RAS aids in rapid, accurate diagnosis of faults whichrequire service.The following RAS features are supported on the platform:Table 5. Memory RAS featuresFeatureDescriptionAdvanced ECCAdvanced ECC is a RAS feature that provides error correctionon single-bit and multi-bit failures that are bound within 4bits (nibble) of memory accesses. When used in conjunctionwith DIMMs based on x4 DRAM devices, Advanced ECC mayprovide error correction to an entire single DRAM device.This type of error correction that covers an entire DRAMdevice has been branded in various forms, most popularizedas Chipkill and Single Device Data Correction (SDDC).Memory Page Retire (MPR)Memory Page Retire (MPR) is a feature implemented byPowerEdge server BIOS that instructs operating systems tostop using memory page locations (4 KB in size) that BIOShas deemed as potentially unhealthy - essentially removingit from the operating system's memory pool. This feature isalso known as Operating System Memory Page Retirement orPage Off-lining. BIOS makes the determination of a potentiallyunhealthy memory page based on a proprietary PowerEdgeserver algorithm that takes into account correctable errorpatterns and error rates at a given memory page location.Fault Resilient MemoryIt is a memory RAS feature that leverages partial memorymirroring to create a fault resilient memory region specificallyfor critical memory functions. This will prevent anyuncorrectable errors in this memory region from generating akernel panic or termination of virtual machines or applications.A comparative advantage of FRM versus full memorymirroring is that the memory capacity overhead can beconfigured based on need. The maximum memory redundancyoverhead for FRM is 25% compared to 50% with full memorymirroring.Memory Self-Healing or PPRIt is an industry-standard capability, defined by JEDEC, wherea memory module is capable of swapping out degraded rowsof memory with spare ones being held in reserve. WhileJEDEC requires that all DDR4 memory be built with at leastone spare row per DRAM bank group, Dell requires all memorysuppliers manufacture genuine Dell DIMMs with a significantlylarger number of available spare rows. This is done to ensurethat PowerEdge servers have a robust self-healing memoryecosystem.14Memory subsystem
Table 5. Memory RAS features (continued)FeatureDescriptionPartial Cache Line Sparing (PCLS)This is a RAS feature in which the iMC uses spare cache linesin CPU to temporarily 'replace' bad DRAM nibblesMemory subsystem15
6StorageTopics: Storage controllersSupported HDDs and SSDsExternal StorageStorage controllersThe Dell PowerEdge RAID Controller (PERC) series-9, series-10 and series-11 family of enterprise-class controllers are designedfor enhanced performance, increased reliability, fault tolerance, and simplified management of your RAID array drives.Table 6. Supported Software ControllersInterfaceSupportCache Memory RAID LevelsSizeRAID SupportMX750c MaxDrivesSupportedS150 SoftwareRAID6Gb/s SATANVMeNo Cache0,1,5,10Software RAID6Internal drivesupportHBA350i MX12Gb/s SAS6Gb/s SAS/SATA 3Gb/sSAS/SATAN/AN/AN/A6Internal drivesupportH745P MX12Gb/s SAS6Gb/s SATA8GB NV0,1,5,6,10,50,60Hardware RAID6 internal, 112from MX5016sstorage sledFor use withboth internaldrives andMX5016sstorage sledH755 MX12Gb/s SAS8 GB NV0,1,5,6,10,50,60Hardware RAID6 internal, 112from MX5016sstorage sledFor use withboth internaldrives andMX5016sstorage sledHBA330 minimezz12Gb/s SASNo CacheNo RAID PassThrough OnlyNo RAID SASHBA112For use withMX5016sstorage sledNOTE: For the most up-to-date and detailed information, please refer to: Dell PowerEdge RAID Controller (PERC) Landing Page for external, customer facing collateral. PERC User’s Guide Dell EMC Sales Portal Servers Knowledge Center for internal facing collateral including roadmaps, product launchdetails, performance data, and competitive data. Storage Controller MatrixSupported HDDs and SSDsThe tables below list the internal SAS and SATA hard drives and SSDs by backplane supported by the MX750c.16Storage
Table 7. Supported HDDs and SSDs (x4 SAS/SATA/NVMe Universal Backplane)x4 SAS/SATA/NVMe Universal BackplaneRaid ConfigurationConfigurationConfigurat S150ion MODH745P MXH755 MXHBA350i MXNo RAID SATA (ChipsetSATA)C20(MSTNR)Y4W6FN/AN/AN/AN/ANo RAID (Chipset PCIe)C30(NVMENR)2WYMBN/AN/AN/AN/ARAID0 SATA (SWRAIDS150)C21(MSTRNR)P4M4RYesN/AN/AN/ARAID1 SATA (SWRAIDS150)C22(MSTR0)R4JK7YesN/AN/AN/ARAID5 SATA (SWRAIDS150)C23(MSTR5)4NKGFYesN/AN/AN/ARAID10 SATA (SWRAIDS150)C24(MSTR10)44RG3YesN/AN/AN/ANo RAID SAS/SATA (Passthrough/HBArequired)C1 (ASSR)84M3TNoNoNoYesRAID0 SAS/SATA (UsingPERC controller)C2 (ASSR0)1D47HNoYesYesNoRAID0NVMe (UsingH755MX controller)C323RVPF(MNVMER0)NoNoYesNoRAID1 SAS/SATA (UsingPERC controller)C3 (ASSR1)5GGWGNoYesYesNoRAID1 NVMe (Using PERC C33controller)(MNVMER1)GGP90NoNoYesNoRAID5 SAS/SATA (UsingPERC controller)C4 (ASSR5)8C7V4NoYesYesNoRAID5 NVMe (UsingPERC controller)C34JHGXD(MNVMER5)NoNoYesNoRAID 10 SAS/SATA (Using C5 (ASSR10) H4WR4PERC controller)NoYesYesNoRAID 10 NVMe (UsingPERC controller)C35PV5YM(MNVMER10)NoNoYesNoUnconfigured SAS/SATA(Using PERC controller)C7(ASSUNC)XTV9HNoYesYesNoUnconfigured NVMe(Using PERC controller)C364JVYK(ANVMER10)NoNoYesNoTable 8. Supported HDDs and SSDs (x6 SAS/SATA/NVMe Universal Backplane)x6 SAS/SATA/NVMe Universal BackplaneRaid ConfigurationConfigurationConfigurat S150ion MODH745P MXH755 MXHBA350i MXNo RAID SATA (ChipsetSATA)C20(MSTNR)Y4W6FN/AN/AN/AN/ANo RAID (Chipset PCIe)C30(NVMENR)2WYMBN/AN/AN/AN/AStorage17
Table 8. Supported HDDs and SSDs (x6 SAS/SATA/NVMe Universal Backplane) (continued)x6 SAS/SATA/NVMe Universal BackplaneRaid ConfigurationConfigurationConfigurat S150ion MODH745P MXH755 MXHBA350i MXRAID0 SATA (SWRAIDS150)C21(MSTRNR)P4M4RYesN/AN/AN/ARAID1 SATA (SWRAIDS150)C22(MSTR0)R4JK7YesN/AN/AN/ARAID5 SATA (SWRAIDS150)C23(MSTR5)4NKGFYesN/AN/AN/ARAID10 SATA (SWRAIDS150)C24(MSTR10)44RG3YesN/AN/AN/ARAID0NVMe (UsingH755MX oRAID5 NVMe (UsingPERC controller)C34JHGXD(MNVMER5)NoNoYesNoRAID 10 NVMe (UsingPERC controller)C35PV5YM(MNVMER10)NoNoYesNoUnconfigured NVMe(Using PERC controller)C364JVYK(ANVMER10)NoNoYesNoRAID1 NVMe (Using PERC C33controller)(MNVMER1)Table 9. Supported HDDs and SSDs (x6 SAS/SATA Low Cost Backplane)x6 SAS/SATA/NVMe Universal BackplaneRaid ConfigurationConfigurationConfigurat S150ion MODH745P MXH755 MXHBA350i MXDisklessC0 (NZC)7GDXMN/AN/AN/AN/ANo RAID SATA (ChipsetSATA)C20(MSTNR)Y4W6FN/AN/AN/AN/ANo RAID SAS/SATA (Passthrough/HBArequired)C1 (ASSR)84M3TNoNoNoYesRAID0 SATA (SWRAIDS150)C21(MSTRNR)P4M4RYesN/AN/AN/ARAID0 SAS/SATA (UsingPERC controller)C2 (ASSR0)1D47HNoYesYesNoRAID1 SATA (SWRAIDS150)C22(MSTR0)R4JK7YesN/AN/AN/ARAID1 SAS/SATA (UsingPERC controller)C3 (ASSR1)5GGWGNoYesYesNoRAID5 SATA (SWRAIDS150)C23(M
USB One internal USB 3.0 port One external USB 3.0 port One USB 2.0 management port to iDRAC One USB 3.0 USB 2.0 port for IDSDM One internal USB 3.0 port One external USB 3.0 port One USB 2.0 management port to iDRAC One USB 3.0 USB 2.0 port for IDSDM Video Integrated VGA controller
